Product Summary

The IRFK2D450 is an isolated base power HEX-pakTM assembly. The HEX-pakTM utilises the well-proven HEXFETTM die, combining low on-state resistance with high transconductance. This superior technology die is assembled by state of the art techniques into the TO-240 package, and the IRFK2D450 features 2.5kV rms isolation and solid M5 screw connections. The smail footprint means the package is highly suited to power applications where space is a premium.

Parametrics

IRFK2D450 absolute maximum ratings: (1)Continuous drain current, LD at TC= 25℃: 22A; (2)Continuous drain current, LD at TC=100℃: 14A; (3)Pulse drain current, IDM: 88A; (4)Maximum power dissioation, PD at TC=25℃: 500W; (5)Gate-to-source voltage, VGS: 20V; (6)R.M.S. isolation voltage, circuit to base, VINS: 2.5kV; (7)Operating junction temperature range, TJ: -40 to 150℃; (8)Storage temperature range, TSTG: -40 to 150℃.

Features

IRFK2D450 features: (1)High current capability; (2)ULrecognised E78996; (3)Electrically isolated base plate; (4)Easy assembly into equipment.

Diagrams

IRFK2D450 circuit diagram

Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
IRFK2D450
IRFK2D450

Other


Data Sheet

Negotiable 
Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
IRFK2D450
IRFK2D450

Other


Data Sheet

Negotiable 
IRFK3D450
IRFK3D450

Other


Data Sheet

Negotiable 
IRFK4HE50
IRFK4HE50

Other


Data Sheet

Negotiable